A Fully-Integrated MMIC Technology Employing a Novel Chip-Size Package

Design for Flip-Chip and Chip-Size Package Technology

As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologies. This movement is occurring at all levels: at the IC, at the IC package, at the module, at the hybrid, the PC board which ties all the systems together. Interconnection density and methodology becomes ...

Integrated Chip–Package–System Simulation

Opportunities are wide open, all across the board. Smart technologies enable countless new applications, driving a range of end-use market sectors and boosting semiconductor sales. The number of networked devices is growing exponentially and globally. R&D teams rapidly pair devices with services, applications and content. At the same time, private companies — not just government agencies or mil...

A Fully Integrated Humidity Sensor System-on-Chip Fabricated by Micro-Stamping Technology

A fully integrated humidity sensor chip was designed, implemented, and tested. Utilizing the micro-stamping technology, the pseudo-3D sensor system-on-chip (SSoC) architecture can be implemented by stacking sensing materials directly on the top of a CMOS-fabricated chip. The fabricated sensor system-on-chip (2.28 mm × 2.48 mm) integrated a humidity sensor, an interface circuit, a digital contro...

A Reliable Wafer-level Chip Scale Package (wlcsp) Technology

In conventional WLCSP process, after defining the under bump metal (UBM) layer, a solder ball is dropped in the UBM opening. A subsequent thermal reflow cycle melts the solder ball and cools it in a well defined shape on top of the UBM layer. One draw back of this technology is the fracture or cracking of passivation film that may occur during the solder ball reflow process. The cracks in the p...

Monolithic Microwave Integrated Circuit (MMIC) Technology for Space Communications Applications